EVALUATION OF EPOXY ADHESIVE THICKNESS IN SIMPLE OVERLAP JOINTS SUBJECTED TO LAP SHEAR

EVALUATION OF EPOXY ADHESIVE THICKNESS IN SIMPLE OVERLAP JOINTS SUBJECTED TO LAP SHEAR

Martins, Michele Damiana Mota; Silveira, Marco Aurélio; Nascimento, Marcio Luis Ferreira; Barbosa, Josiane Dantas Viana; Pisanu, Luciano

Full article:

Epoxy adhesives are widely used in the automotive and aerospace markets and have gained notoriety for their versatility and ease of modification to achieve different properties. The purpose of this article was to study simple overlap joints in different thicknesses, 0.1, 0.25 and 0.5 mm, of a two-part epoxy-based structural adhesive under lap shear. In addition, the failure profile of the adhesive on the adherent and the fracture surface of he joints were analyzed by scanning electron microscopy (SEM). The results showed greater resistance to lap shear of simple overlap joints with 0.1 mm of adhesive thickness, failure with stress bleaching and, in the SEM’s images, the presence of glass spheres.

Epoxy adhesives are widely used in the automotive and aerospace markets and have gained notoriety for their versatility and ease of modification to achieve different properties. The purpose of this article was to study simple overlap joints in different thicknesses, 0.1, 0.25 and 0.5 mm, of a two-part epoxy-based structural adhesive under lap shear. In addition, the failure profile of the adhesive on the adherent and the fracture surface of he joints were analyzed by scanning electron microscopy (SEM). The results showed greater resistance to lap shear of simple overlap joints with 0.1 mm of adhesive thickness, failure with stress bleaching and, in the SEM’s images, the presence of glass spheres.

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DOI: 10.5151/siintec2023-306146

Referências bibliográficas

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Como citar:

Martins, Michele Damiana Mota ; Silveira, Marco Aurélio ; Nascimento, Marcio Luis Ferreira ; Barbosa, Josiane Dantas Viana ; Pisanu, Luciano ; "EVALUATION OF EPOXY ADHESIVE THICKNESS IN SIMPLE OVERLAP JOINTS SUBJECTED TO LAP SHEAR", p-350-356. In: . São Paulo: Blucher, 2023.
ISSN 23577592, DOI 10.5151/siintec2023-306146