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Zhu, Xiaoxin; Kotadia, hiren; Xu, Sha; Lu, Hua; Mannan, Samjid. H.; Bailey, Chris; Chan, Y.C;

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In this work, previous simulation works on electro-migration have been reviewed, and a multi-physics EM simulation method that combines electric, thermal, atomic diffusion and stress analysis has been proposed. The method is able to solve vacancy concentration distribution with coupling electric current, temperature gradient, hydro-static stress gradient simultaneously and to mimic void formation in realistic structure of microelectronics devices.

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Palavras-chave: Electro-migration, Thermo-migration, Stress-migration, Multi-Physics, Modelling.,


DOI: 10.5151/meceng-wccm2012-18799

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Como citar:

Zhu, Xiaoxin; Kotadia, hiren; Xu, Sha; Lu, Hua; Mannan, Samjid. H.; Bailey, Chris; Chan, Y.C; "PROGRESS IN THE DEVELOPMENT OF AN ELECTRO-MIGRATION MODELLING METHODOLOGY", p. 2275-2287 . In: In Proceedings of the 10th World Congress on Computational Mechanics [= Blucher Mechanical Engineering Proceedings, v. 1, n. 1]. São Paulo: Blucher, 2014.
ISSN 2358-0828, DOI 10.5151/meceng-wccm2012-18799

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